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General Papers

Effects of Belt Speed (1.31 MB)

Closed Loop Convection Paper (792.79 KB)

BME Paper for CARTS 2001 (67.49 KB)

Flux Free Wafer Bump Reflow (118.95 KB)

Glass to Metal Sealing (854.34 KB)

High Temperature Continuous Process (112.43 KB)

Improving Reflow wSPC Part I (227.34 KB)

Improving Reflow wSPC Part II (1.03 MB)

Improving Reflow wSPC Part III (218.07 KB)

SMT Magazine Step 7 Soldering (61.61 KB)

Wafer Level Packaging _ SECAP (2.88 MB)

Lead Free Papers

AP Lead Free Wafer Bump Reflow (150.86 KB)

Lead Free Oven Selection (634.52 KB)

Lead Free Reflow July 2004 (381.29 KB)